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506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_UQFN_4x4x0_5mm_JQ_C04257A.pdf.

171.75 125 (end 164.22 117.1225 (end 164.22.
-9.838707e-002 1.596288e-004 9.951482e-001 facet normal 4.107943e-07 -1.000000e+00 5.748679e-07.
236-605 45Degree pitch 7.5mm size.
30.5x8mm^2 drill 1.3mm pad.

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