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Mm (1050 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing.

• Vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP.
• -4.50343 19.9409 facet normal 0.885449 0.0559554 0.461356.

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