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HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SH MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, with latches, PN:G125-MVX1605L1X Harwin Gecko Connector, 50 pins, dual row female, vertical entry, with latches, PN:G125-MVX5005L1X Harwin LTek Connector, 22 pins, single row Through hole IDC header, 2x05, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x03 1.27mm double row Through hole angled pin header SMD 2x37 2.54mm double row surface-mounted straight pin header, 2x07, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x12 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x14, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 pads, pad diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_power_slf12555_en.pdf Inductor, TDK, MLZ1608, 1.6x0.8x0.8mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz1608_en.pdf" Inductor, TDK, SLF7055, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-BE-A, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [HTSSOP], with thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition.

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