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1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header THT 2x01 2.54mm double row Through hole angled pin header, 1x29, 2.54mm pitch, single row Through hole angled socket strip, 2x38, 2.54mm pitch, single row Through hole angled pin header THT 1x38 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x05 1.27mm double row Through hole angled pin header THT 2x30 2.54mm double row Through hole straight pin header, 1x20, 1.27mm pitch, 4.0mm pin length, single row Through hole straight socket strip, 1x36, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x12, 2.54mm pitch, double rows Through hole angled pin header, 2x33, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x15 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x03 1.27mm single row Through hole angled socket strip SMD 1x07 1.27mm single row style2 pin1 right Through hole pin header THT 2x12 2.00mm double row Through hole angled pin header, 2x19, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x40, 2.00mm pitch, single row style2 pin1 right Through hole pin header SMD 2x06 2.00mm double row Through hole straight socket strip, 1x26, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip SMD 1x29 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x33 2.00mm single row Through hole angled pin header, 2x40, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x12, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x31 1.00mm single row style2 pin1 right Through hole pin header THT 1x22 2.00mm single row Through hole angled pin header, 1x13, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x20 2.54mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x07, 5.08mm pitch, single row Surface mounted pin header SMD 2x02 1.00mm double row surface-mounted straight pin header, 1x19, 1.27mm pitch, single row Through hole straight pin header, 1x26.

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