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Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 2x11 2.00mm double row Through hole pin header SMD 1x37 1.27mm single row Through hole pin header THT 2x28 1.27mm double row Through hole vertical IDC box header THT 1x01 5.08mm single row Surface mounted pin header THT 2x04 1.27mm double row Through hole angled pin header THT 2x05 2.00mm double row Through hole straight socket strip, 2x14, 1.00mm pitch, double rows Surface mounted pin header THT 2x03 2.54mm double row Through hole IDC header, 2x30, 2.54mm pitch, double rows Surface mounted socket strip THT 2x24 2.54mm double row Through hole pin header SMD 1x02 1.00mm single row style2 pin1 right Through hole angled socket strip, 1x14, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x15, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header, 2x28, 1.27mm pitch, double rows Through hole socket strip SMD 1x27 1.27mm single row style2 pin1 right Through hole straight socket strip, 2x32, 2.54mm pitch.

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