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64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 12-lead though-hole mounted DIP package, row spacing 7.62.

• TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch.
• 2 Latest commits for file Panels/FIREBALL VCO.png.
• HLE-111-02-xxx-DV-BE-LC, 11 Pins per.
• SMD 1x12 1.27mm single row Through hole straight.

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