Labels Milestones
BackWLCSP-52, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x29, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole IDC header, 2x07, 2.54mm.
- MuRata MEJ1SxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC.
- 1x28 2.00mm single row Through hole pin header.
- Size 45x10.3mm^2, drill diamater 1.15mm, pad.