Labels Milestones
Back42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 1x11 1.27mm single row Surface mounted socket strip SMD 1x06 2.54mm single row style2 pin1 right Through hole socket strip THT 2x36 2.00mm double row Through hole straight socket strip, 2x05, 2.00mm pitch, double rows Through hole pin header SMD 1x31 2.00mm single row Through hole Samtec HPM.
- Layout Initial stab at a 10-step.
- Or 2.5mm center pin, https://www.kycon.com/Pub_Eng_Draw/KLDX-0202-AC%20&%20BC.pdf.