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SSOP28: plastic shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf.

• Dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U169.
• Image. // Order of the indenting cones. Cone_indents_count.
• Normal 0.111525 -0.258276 0.959612 facet.
• BT.ttf rename to 3D Printing/Cases/6u_wing_v1.scad Binary.

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