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Thermal pad HTSSOP32: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-130-xx.x-x-DV-S, 30 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf), generated with kicad-footprint-generator JST PH series connector, 53261-1771 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 7, Wuerth electronics 9775066360 (https://katalog.we-online.com/em/datasheet/9775066360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/drv8662.pdf#page=23), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF13-07P-1.25DSA, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE.

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