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Insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-035, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf Footprint for.

• (Linear Tech), 133-pin BGA.
• 8.11431 facet normal 0.161777.
• Vertex 6.573270e+000 -2.717840e+000 9.983999e+000 vertex 7.097801e+000 1.470900e-002 2.496000e+001.

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