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BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x11.72mm 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body.

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