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30.9x6.2mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10697.pdf, script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type101_RT01606HBWC, 6 pins, pitch 5.08mm, size 50.8x9.8mm^2, drill diamater 1.3mm, pad diameter 2.5mm, hole diameter 2.0mm wire loop with bead as test Point, diameter 2.0mm, 2 pins Red 5381 Series LED Green 5381 Series LED Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Green 5381 Series LED A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight socket strip, 2x12, 1.27mm pitch, single row Surface mounted pin header SMD 1x25 2.54mm single row Through hole straight pin header, 2x36, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x09, 1.27mm pitch, single row Through hole angled socket strip THT 2x09 1.27mm double row Through hole socket strip THT 2x16 1.00mm double row surface-mounted straight pin header, 1x05, 1.27mm pitch, double rows Through hole angled pin header SMD 1x32 1.00mm single row Through hole angled pin header THT 1x18 5.08mm single row Surface mounted socket strip SMD 2x40 2.00mm double row Through hole pin header SMD 1x03 2.00mm single row Through hole straight pin header, 1x40, 2.00mm pitch, 6.35mm socket length, double rows Through hole IDC box header 2x04 2.54mm double row Through hole angled socket strip, 2x30, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x05 1.27mm single row male, vertical entry, no latches, PN:G125-MVX0605L0X.

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