Labels Milestones
Back0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Tactile Switch for High-Density Packaging with Ground Terminal, with Boss SPST button tactile switch SPST angled PTS645VL39-2 LFS C&K Button tactile switch SPST angled PTS645VL58-2 LFS C&K Button SW PUSH SMALL Tactile C&K Generic Buzzer, D15mm height 7.5mm with RM7.6mm Generic Buzzer, D15mm height 7.5mm with RM7.6mm Generic Buzzer, D12mm height.
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