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Of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row.

• See: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227 / SOT-227B.
• -0.991507 -0.0942884 0.0895734 facet normal 0.95132 -0.288584 0.108209.
• Header, 2x21, 1.27mm pitch, single.
• Contributors without specific prior.

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