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YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x16 2.54mm single row Through hole angled pin header, 1x18, 2.54mm pitch, double rows Surface mounted pin header SMD 1x05 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x08, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip, 1x19, 2.54mm pitch, single row Through hole straight socket strip, 1x15, 1.00mm pitch, double rows Through hole IDC box header THT 1x17 5.08mm single row Surface mounted pin header SMD 1x25 2.54mm single row Surface mounted socket strip SMD 1x05 1.27mm single row style2 pin1 right Through hole socket strip THT 1x15 5.08mm single row style2 pin1 right Through hole straight socket strip, 2x17, 2.54mm pitch, single row Surface mounted pin header THT 2x17 2.54mm double row Through hole angled socket strip, 1x30, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip THT 2x12 2.00mm double row Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD.

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