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400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 25.4 mm (1000 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, horizontal, https://www.cliffuk.co.uk/products/testleads/sockets/S16NPC.pdf cliff 4mm socket jack banana C5080 SERIES 90° Wafer, (https://datasheet.lcsc.com/lcsc/1912261836_HR-Joint-Tech-Elec-C5080WR-04P_C477015.pdf connector side-entry ATA PATA IDE 5.25 inch floppy drive power USB 3.0, type A, right angle, http://spec_sheets.e-switch.com/specs/P040170.pdf Switch, single pole normally-open illuminated tactile switch D Switch, three position, dual pole double throw, separate symbols Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14"/> 16369 bytes main ENV/.gitignore 32 lines main MK_SEQ/Schematics/notes.txt 35 lines Binary files /dev/null and b/3D Printing/Rails/36hp_innie.stl differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell.

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