Labels Milestones
Back(SO) - Wide, 5.3 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case MMM168, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-230, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 6 // manual reset (sw16 // 8 Sockets: // clock out (j5/j12) // glide in (sleeve and normal both GND 6x Sockets, 2pin: - all step switches (all go to same bus) - run/stop 2x Pushbutton switches, all 2pin: - reset Pots, 3-pin: - Glide attenuator (B10k) (join two left pins from below Clock POT is too small; need more than 100k to get below 200bpm - C1 is too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be more robust and easier to adjust parameters for. 1.0 2012-03-?? Initial release at https://www.thingiverse.com/thing:20513 . Based on a medium customarily used for a single 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PHD series connector, B04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wire.
New Pull Request