3
1
Back

4.4 mm; thermal pad with vias HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101), generated with kicad-footprint-generator JST XH series connector, B20B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0300, 30 Circuits (https://www.molex.com/pdm_docs/sd/2005280300_sd.pdf), generated with kicad-footprint-generator Molex Pico-Lock series.

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