Labels Milestones
BackPin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout.
- 170 115 (end 171.7525 112.123666.
- -5.036913e+000 9.983999e+000 vertex 1.269793e+000 6.921616e+000.
- (see cra04p.pdf Chip Resistor Network, ROHM MNR32.