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Dual Flatpack No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x20 2.54mm double row Through hole straight pin header, 2x27, 1.27mm pitch, double rows Surface mounted socket strip THT 2x24 1.27mm double row Through hole socket strip THT 2x08 2.54mm double row Through hole angled pin header, 1x29.

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