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TO-220F-9, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 2.54mm staggered type-1 TO-220F-11, Vertical, RM 2.54mm, staggered type-2 TO-220-5, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 2.54mm staggered type-1 TO-220-11, Vertical, RM 2.54mm, staggered type-1 TO-220-9 Horizontal RM 10.9mm TO-264-2, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 4.58mm IPAK TO-251-3, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-5 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-15, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 10.95mm SOT-93 TO-218-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 7x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 25.4.

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