Labels Milestones
Back3.170x3.444mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1.
- -1.068490e+02 9.715134e+01 1.020704e+01 vertex -1.071780e+02 9.725134e+01 1.020809e+01.
- Normal 0.000825124 -0.1132 0.993572 vertex 0.994975.
- 1 week 1 day 08c0726655 Added BCN.
- Ceramic may work, test debouncing. Maybe enlarge footprint.