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20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: unplated through holes: ============================================================= 2d3c489f2acf0f8bdc9cf0fe8c2346d4d07472be c9e81f0cc630cea052574ce7c50b3e82145bb626 f51b7b97734e404127fa5d5d263acbfd66f116e4 Add schematic, start on PCB sandwich, making some final-ish decisions about connecting to front.

• 1.10469 19.8418 vertex 5.57623 2.17372 19.9.
• Https://www.xppower.com/Portals/0/pdfs/SF_ISU02.pdf DCDC SMD XP POWER.
• 0.482255 -0.870372 0.0994135 facet.

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