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CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3x3mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Capacitor SMD Kemet-C (6032-28 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-144 , 14 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator JST PUD series connector, DF52-8S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xxx-DV, 34 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf), generated with kicad-footprint-generator JST GH series connector, 502382-0470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST VH series connector, SM14B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.25 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size 24.5x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-8-5.08 pitch 5.08mm 2W length 15.5mm diameter 5mm Fastron MISC Inductor, Axial series, Axial, Horizontal, pin pitch=7.62mm, , length*diameter=4*2mm^2, , http://www.diodes.com/_files/packages/DO-35.pdf Diode.

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