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483, 3.73x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 13, Wuerth electronics 97730256332 (https://katalog.we-online.com/em/datasheet/97730256332.pdf), generated with kicad-footprint-generator JST XA series connector, 502585-1470 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4030, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, 53398-0871 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin, exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0270, 27 Circuits (https://www.molex.com/pdm_docs/sd/2005280270_sd.pdf), generated with kicad-footprint-generator JST PH series connector, 502386-1170 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1230, 12 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.8mm SMD capacitor, aluminum electrolytic, Vishay 1014, 10.0x14.3mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic nonpolar, 5.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic nonpolar, 6.3x7.7mm SMD capacitor, aluminum electrolytic nonpolar, 6.3x5.4mm SMD capacitor, aluminum electrolytic, Vishay, 4.0x5.3mm SMD capacitor, aluminum electrolytic, Panasonic B45, 5.0x4.4mm SMD capacitor.

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