3
1
Back

Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x12 1.00mm double row surface-mounted straight pin header, 1x23, 1.27mm pitch, single row style2 pin1 right Through hole socket strip THT 1x04 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x12 2.54mm double row Through hole angled socket strip THT 2x38 1.27mm double row Through hole angled socket strip THT 2x14 1.00mm double row surface-mounted straight socket strip, 2x09, 2.00mm pitch, double.

New Pull Request