synth_tools

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Header, e.g. For Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x39 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x05 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x14, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x04, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x30 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x24, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x17, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x26, 2.00mm pitch, double rows Surface mounted pin header THT 1x21 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 1x27 2.54mm single row Through hole angled pin header THT 2x32 2.54mm double row Through hole socket strip THT 1x29 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x25 2.54mm double row Through hole angled pin header, 2x17, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted socket strip THT 2x22 2.00mm double row Through hole IDC header, 2x25, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN.

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