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# Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: merged pull request 'pcb_finalization' (#1) from bugfix/10hp into main ... Add jlc constraints DRC.

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