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JAE side entry connector harwin ltek M80 Harwin LTek Connector, 26 pins, single row style2 pin1 right Through hole straight pin header, 1x07, 2.54mm pitch, 6mm pin length, single row Through hole pin header THT 2x10 2.54mm double row Through hole straight pin header, 1x29, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x25, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x11 2.54mm single row Through hole angled pin header, 2x32, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x02, 2.54mm pitch, single row Through hole pin header THT 2x10 1.27mm double row Through hole pin header THT 2x08 2.54mm double row Through hole angled pin header, 2x32, 2.54mm pitch, single row Through hole angled pin header THT 2x36 2.54mm double row Through hole socket strip SMD 1x38 2.00mm single row style2 pin1 right Through hole angled pin header, 2x36, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip THT 1x20 2.54mm single row Surface mounted socket strip THT 2x10 2.00mm double row Through hole angled pin header, 1x26, 2.00mm pitch, 6.35mm socket length, single row male, vertical entry Harwin LTek Connector, 8 pins, pitch 7.5mm, size 17.3x14mm^2, drill diamater 1.4mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf TDFN, 14 Pin (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator Hirose series connector, 505405-0270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (https://ww2.minicircuits.com/case_style/DQ1225.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33), generated with kicad-footprint-generator XP_POWER IAxxxxD DIP.

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