Labels Milestones
BackSPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 48-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket 40-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera.
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