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X="5.35" y="1.4"/> <-- CV In main MK_VCO/Panels/fireball_vco_14hp_v1.scad 330 lines width = 38; // [1:1:84] working_height = height - v_margin*2 - title_font_size*1.5; // surface("FireballSpellSmall.png", center=true, invert=false); */ module label(string, size=4, halign="center", font=default_label_font) { color([1,0,0]) linear_extrude(height) text(string, size, halign=halign, font=font_for_title); //} // draw panel, subtract holes panel(width); // Top radius of the documentation. Condition "A.Type == 'via' && B.Type == A.Type" condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == 'graphic')" (condition "A.Type == 'via' && B.Type == 'graphic')" (condition "A.Type == 'via' && B.Type == 'graphic')" # This would override board outline and milled areas # (condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == A.Type" condition "A.Type == 'pad' && B.Type == 'graphic')" (condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'" (condition "A.Net != B.Net" (condition "A.Type == 'pad' && !A.isPlated()" (condition "A.Type == 'pad' && B.Type == 'track'" ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Thu Aug 12 15:59:21 2021 ac58a9eaed checkpoint after roughing out middle PCB Move LED resistors aa199fc6f4 Forget (and ignore) fp-info-cache file as it is based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.5mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf.

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