3
1
Back

Connect Type703_RT10N03HGLU pitch 9.52mm size 19x12.5mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00048 pitch 5mm size 70x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type067_RT01905HDWC pitch 10mm length 3.8mm diameter 2.6mm Single phase bridge rectifier case 15.1x15.1mm, pitch 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc600.pdf Single phase bridge rectifier case 15.2x15.2mm, pitch 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 2.54mm TO-247-5, Vertical, RM 2.54mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.54mm TO-220-4 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 0.9mm staggered type-2 TO-220-7 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 5.08mm TO-126-2, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 5.08mm TO-220-2, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x24.42mm 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 25.4.

New Pull Request