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BackYou'll note several of these should be the same, the other - ground planes are copper fill applied everywhere there isn't a trace already - use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering - ground plane created pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 | Refs | Qty | Component | Description | Manufacturer | Part | Vendor | SKU | | | | | | | | | | | | R1, R10, R11 | 3 | 1k | Resistor | | | R30 | 1 | B20k | Potentiometer | | Tayda | A-826 | | R9, R11, R13 | 3 | 10k | Resistor | | | R23, R24, R25, R27 | 4 .../PCB/precadsr_Gerbers/precadsr-F_Mask.gbr | 481 .../PCB/precadsr_Gerbers/precadsr-B_Paste.gbr.
- 1.055465e+02 2.655000e+01 facet normal 0.499988.
- Pitch 1.20 no EP.
- 3.09018 7.46035 5.88782 facet normal 0.995114 0.0980109 -0.0119198.
- 2.310320e+000 2.486861e+001 facet normal -4.323907e-002 -7.566841e-002.
- DEF SW_Push_45deg SW 0 40 Y N 1.