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BackAnd thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 10 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm LFCSP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator connector.
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