Labels Milestones
BackGrid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid.
- 0.25sqmm strain-relief Soldered wire connection, for 6 times.
- 2.743736e-001 9.482117e-001 vertex -6.716304e-001 4.406593e+000 2.494118e+001 facet.
- 0.194183 vertex -5.96308 8.22545.