Labels Milestones
BackOutline (SO) - Wide, 5.3 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip SMD 2x09 1.00mm double row Through hole straight pin header, 1x14, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x01 2.54mm single row style2 pin1 right Through hole angled socket strip THT 1x30 1.00mm single row Through hole socket strip THT 2x34 1.27mm double row Through hole angled pin header, 1x32, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled pin header.
New Pull Request