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Https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for the Covered Software, or under the smaller board, for convenience Casc Out normal to Reset In socket - Reset Socket to U3-3 = capacitor measurement roughly 15nF (has a resistor as well - Once/Cont 11 Toggle Switches, 2pin: - all step switches (all go to same bus run/stop 2x Pushbutton switches, all 2pin: - step - reset in - glide in (sleeve and normal both GND - Gate out (could normal to TP10, optional) - Casc out 2x Toggle Switches, 2pin: - step - reset in - CLOCK out // 1 for 5v / 2.5v output mode (sw12) // 1 for manual glide (rv16 // 1 for manual reset (sw16 // 8 Sockets: // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13 // gate out (j4/j10) // clock in (j2/j11 // casc.

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