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Back*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5.
- -2.0532 -2.04871 18.9333 vertex 2.27697 -1.77649 18.9096.
- 0.3389 0.923218 vertex 8.83147 1.71116 3.82299 facet.