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WLCSP-100, off-center ball grid, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x36, 1.27mm pitch, single row Surface mounted socket strip SMD 1x16 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x30 1.00mm double row Through.

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• 1.342376e-13 facet normal 0.192821 -0.747983 0.635092 facet.

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