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Kycon KDMIX-SL1-NS-WS-B15, Vertical Right Angle, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0120, 12 Circuits (https://www.molex.com/pdm_docs/sd/2005280120_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4.5, Wuerth electronics 9775096960 (https://katalog.we-online.com/em/datasheet/9775096960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py USON, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1430, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-20DP-2DSA, 10 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-170 , 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B06B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [QFN] with thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin, exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin, exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf.

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