Labels Milestones
BackHigh-volatge DIP package (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.
- YFF0006 Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf.
- Connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf USB USB_B USB_micro USB_OTG USB Micro-B.