3
1
Back

Diode bridges, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row.

New Pull Request