Labels Milestones
BackSided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm.
New Pull Request