Labels Milestones
BackSB484 SBG484 SBV484 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array.
- Module. Layout and panel are Kosmo format. .
- 7.37319 vertex 0.672644 -6.71541 7.35649 vertex.
- AVX-R (7260-15 Metric), IPC_7351 nominal, (Body size.
- -9.958892e-001 9.057941e-002 0.000000e+000 vertex 1.917059e+000 -5.367621e+000 1.747200e+001 facet.