Labels Milestones
Back50mm CopperTop Type 4 Gauge, Massstab, 100mm, CopperTop, Type 2, Copper Top, Big, Symbol, CC-Share Alike, Copper Top, Big, Symbol, CC-Noncommercial Alike, Copper Top, Small, GNU-Logo, GNU-Head, GNU-Kopf, Silkscreen, Symbol, HighVoltage, Type1, Copper Top, GNU-Logo, GNU-Head, GNU-Kopf, Copper Top, Small, GNU-Logo, GNU-Head, GNU-Kopf, Copper Top, Small, Symbol, Highvoltage, Type 2, Gauge Massstab 10mm CopperTop Type 2 SMT capacitor, aluminium electrolytic, 3x5.3, Cornell Dubilier Electronics SMD capacitor, aluminum electrolytic, Rubycon, 8.0x6.5mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x6.2mm SMD capacitor, aluminum electrolytic, Nichicon, 10.0x10.0mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Vishay 1821, 18.0x22.0mm, http://www.vishay.com/docs/28395/150crz.pdf Capacitor SMD AVX-M (7260-20 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST SUR series connector, 78171-0003 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-0230, 2 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator JST GH series connector, BM03B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274), generated with kicad-footprint-generator JST SUR side entry JST SH series connector, S10B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5120, 12 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat No Lead Package (8MA2) - 2x3x0.6 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 5.25 mm (206 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body.
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