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Primary and one with an eye towards doing it all in one module with WiFi, https://www.adafruit.com/product/2471 Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R3, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf 8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf Pololu Breakout 16-pin 15.2x20.3mm 0.6x0.8\ Raspberry Pi Zero using through hole M3, height 4.6, Wuerth electronics 9774130360 (https://katalog.we-online.de/em/datasheet/9774130360.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-10DP-0.5V, 10 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic DFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (ST)-4.4 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (https://docs.broadcom.com/doc/APDS-9251-001-DS#page=19), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_automotive_power_slf12575-h_en.pdf inductor TDK VLS SMD VLS6045EF VLS6045AF Tai Tech TMPC1265 SMD inductor Bourns SRR1210A SMD inductor https://www.bourns.com/docs/Product-Datasheets/SRR1210A.pdf Bourns SRR1210A series SMD inductor https://www.bourns.com/docs/Product-Datasheets/SRR1210A.pdf Bourns SRR1210A series SMD inductor Bourns SRU1028 series SMD Inductor Bourns SRR1260 SMD inductor Bourns SRR1005 series SMD inductor Bourns SRN6028 series SMD inductor Inductor, Bourns, SRF1260, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-U (7132-20 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.25 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B38B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin 2x2mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad.

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