Labels Milestones
BackSpacing 11.43 mm (450 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package.
- 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF), generated with kicad-footprint-generator.
- Relay socket DPDT Finder 96.12 56.32.