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With enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline Narrow Body (QR)-.150" Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted socket strip SMD 2x01 2.54mm double row surface-mounted straight pin header, 2x16, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x30 1.27mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x23 2.54mm double row Through hole angled pin header SMD 1x06 1.27mm single row style2 pin1 right Through hole angled pin header, 2x37, 1.00mm pitch, double rows Surface mounted socket strip THT 1x36 2.54mm single row Through hole straight pin header, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 1x09, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x07, 2.00mm pitch, 4.2mm.

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