Labels Milestones
Back(450 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET S3C MOSFET Infineon.
- 14.7x7mm^2 drill 1.2mm pad 2.4mm.
- Licensed Patents. The patent license.
- ISO14580 mounting hole 6.4mm.